On 02/11/2014 12:34 AM, Michael Hennebry wrote: <> On Mon, 10 Feb 2014, g wrote:
because of stiffness of the heat carriage tubes, may not need to worry.
You are suggesting that the heat pipes might support the radiator and keep it off its board?
this is true.
Now that I look again, that appears to be the case. Not only that, the radiator is tilted so that only the right front corner is close to the board.
(BWG)
i notice that also.
That area of the board is empty except for a UPC sticker.
who said we who engineer do not know how to think? ;-)
you would be very surprised at just how much time is spent in trying to "tear down" a new system design. heat sinking is an on going challenge.
ic voltage levels where dropped for 2 main reasons, switching rate time and heat build up.
the main reason for the design of transistors was to decrease size of a cpu so that it would fit in an aerospace craft. be it a 'sputnik' or a 'mars rover'. size is not the problem. heat is and seems like it always will be.
when electrons flow in a confined space, hit will be produced.
i would say that your biggest worry is if you are adding or removing a card and drop the back plain screw behind the high side of the head sink and it happens to short a solder or transition point.
for sure, be careful of dropping anything metallic inside a computer box. especially if laid with pcb at bottom.
"npi", but always, "cyoa".