On 02/11/2014 12:34 AM, Michael Hennebry wrote: <> On Mon, 10 Feb 2014, g wrote: >> because of stiffness of the heat carriage tubes, may not >> need to worry. > > You are suggesting that the heat pipes might > support the radiator and keep it off its board? this is true. > Now that I look again, that appears to be the case. > Not only that, the radiator is tilted so that > only the right front corner is close to the board. (BWG) i notice that also. > That area of the board is empty except for a UPC sticker. who said we who engineer do not know how to think? ;-) you would be very surprised at just how much time is spent in trying to "tear down" a new system design. heat sinking is an on going challenge. ic voltage levels where dropped for 2 main reasons, switching rate time and heat build up. the main reason for the design of transistors was to decrease size of a cpu so that it would fit in an aerospace craft. be it a 'sputnik' or a 'mars rover'. size is not the problem. heat is and seems like it always will be. when electrons flow in a confined space, hit will be produced. i would say that your biggest worry is if you are adding or removing a card and drop the back plain screw behind the high side of the head sink and it happens to short a solder or transition point. for sure, be careful of dropping anything metallic inside a computer box. especially if laid with pcb at bottom. "npi", but always, "cyoa". -- peace out. in a world with out fences, who needs gates. tc.hago. g .